JPH0311778Y2 - - Google Patents
Info
- Publication number
- JPH0311778Y2 JPH0311778Y2 JP2103084U JP2103084U JPH0311778Y2 JP H0311778 Y2 JPH0311778 Y2 JP H0311778Y2 JP 2103084 U JP2103084 U JP 2103084U JP 2103084 U JP2103084 U JP 2103084U JP H0311778 Y2 JPH0311778 Y2 JP H0311778Y2
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- key top
- plate
- push
- double
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000002390 adhesive tape Substances 0.000 claims description 12
- 125000006850 spacer group Chemical group 0.000 claims description 9
- 238000003825 pressing Methods 0.000 description 6
- 238000004080 punching Methods 0.000 description 5
- 230000004907 flux Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 229910001220 stainless steel Inorganic materials 0.000 description 4
- 239000010935 stainless steel Substances 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2103084U JPS60133532U (ja) | 1984-02-15 | 1984-02-15 | プツシユ式スイツチ |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2103084U JPS60133532U (ja) | 1984-02-15 | 1984-02-15 | プツシユ式スイツチ |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS60133532U JPS60133532U (ja) | 1985-09-05 |
JPH0311778Y2 true JPH0311778Y2 (en]) | 1991-03-20 |
Family
ID=30512062
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2103084U Granted JPS60133532U (ja) | 1984-02-15 | 1984-02-15 | プツシユ式スイツチ |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60133532U (en]) |
-
1984
- 1984-02-15 JP JP2103084U patent/JPS60133532U/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS60133532U (ja) | 1985-09-05 |
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